Parylene Technology
Parylene Technology


Parylene Properties and Variants

Parylene N Properties

Parylene N has the highest dielectric strength of the three versions, and a dielectric constant value independent of frequency. It is able to penetrate crevices more effectively than the other two versions because of the higher level of molecular activity that occurs during deposition. Parylene N is commonly used in high frequency applications because of its low dissipation factor and dielectric constant values.

Parylene C Properties

Parylene C differs chemically, having a chlorine atom on the benzene ring that results in a useful combinationof electrical and physical properties including particularly low moisture and gas permeability. This version deposits on substrates faster is than Parylene N, with a consequent reduction in crevice penetration activity.

Parylene D Properties

Parylene D has two chlorine atoms added to the benzene ring. This gives the resulting film greater thermal stability than either Parylene N or C. It has reduced ability to penetrate crevices compared to Parylenes N and C.

For additional information about these Parylene types, please view the Para Tech Parylene Properties Chart.

Deposition Process > Advantages & Benefits > Raw Materials >